JAN1N4370AUR-1
vs
MLL5221BTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
MELF-2
O-LELF-R2
Reach Compliance Code
compliant
unknown
Factory Lead Time
20 Weeks
Additional Feature
METALLURGICALLY BONDED
TR, 7 INCH: 2000
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
30 Ω
30 Ω
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
200 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
2.4 V
2.4 V
Reverse Current-Max
100 µA
100 µA
Reverse Test Voltage
1 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Temp Coeff-Max
-2.04 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
8
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Knee Impedance-Max
1200 Ω
Compare JAN1N4370AUR-1 with alternatives
Compare MLL5221BTR with alternatives