JAN1N3910
vs
BYX65-100
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
STMICROELECTRONICS
|
Package Description |
DO-5, 1PIN
|
|
Reach Compliance Code |
compliant
|
compliant
|
Application |
FAST RECOVERY
|
VERY FAST RECOVERY
|
Case Connection |
ISOLATED
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-203AB
|
|
JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
JESD-609 Code |
e0
|
|
Non-rep Pk Forward Current-Max |
300 A
|
300 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
1
|
1
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Output Current-Max |
50 A
|
30 A
|
Package Body Material |
METAL
|
METAL
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
Qualification Status |
Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/308
|
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Reverse Recovery Time-Max |
0.2 µs
|
0.1 µs
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
Terminal Position |
UPPER
|
UPPER
|
Base Number Matches |
4
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.80
|
Additional Feature |
|
LEAKAGE CURRENT IS NOT AT 25 DEG C
|
Forward Voltage-Max (VF) |
|
1.5 V
|
Power Dissipation-Max |
|
50 W
|
Reverse Current-Max |
|
10000 µA
|
|
|
|
Compare JAN1N3910 with alternatives
Compare BYX65-100 with alternatives