IXTN61N50
vs
APT50M60JN
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
IXYS CORP
|
ADVANCED POWER TECHNOLOGY INC
|
Package Description |
FLANGE MOUNT, R-PUFM-D4
|
FLANGE MOUNT, R-PUFM-X4
|
Pin Count |
4
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
500 V
|
500 V
|
Drain Current-Max (ID) |
61 A
|
71 A
|
Drain-source On Resistance-Max |
0.075 Ω
|
0.06 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
R-PUFM-D4
|
R-PUFM-X4
|
Number of Elements |
1
|
1
|
Number of Terminals |
4
|
4
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
625 W
|
690 W
|
Pulsed Drain Current-Max (IDM) |
244 A
|
284 A
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Form |
SOLDER LUG
|
UNSPECIFIED
|
Terminal Position |
UPPER
|
UPPER
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
HTS Code |
|
8541.29.00.95
|
Feedback Cap-Max (Crss) |
|
1200 pF
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Power Dissipation Ambient-Max |
|
690 W
|
Reference Standard |
|
UL RECOGNIZED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Turn-off Time-Max (toff) |
|
125 ns
|
Turn-on Time-Max (ton) |
|
105 ns
|
|
|
|
Compare IXTN61N50 with alternatives
Compare APT50M60JN with alternatives