ISL6208CRZ-T
vs
ISL6208IR
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
QFN, SOIC
|
QFN
|
Package Description |
3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220, QFN-8
|
HVQCCN, LCC8,.12SQ,25
|
Pin Count |
8, 8
|
8
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
26 Weeks
|
|
High Side Driver |
YES
|
YES
|
Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
JESD-30 Code |
S-PQCC-N8
|
S-PQCC-N8
|
JESD-609 Code |
e3
|
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-10 °C
|
-40 °C
|
Output Peak Current Limit-Nom |
4 A
|
4 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC8,.12SQ,25
|
LCC8,.12SQ,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Turn-on Time |
0.03 µs
|
0.03 µs
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
3
|
6
|
|
|
|
Compare ISL6208CRZ-T with alternatives
Compare ISL6208IR with alternatives