ISL6208IR
vs
ISL6208IBZ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTERSIL CORP
INTERSIL CORP
Part Package Code
QFN
QFN, SOIC
Package Description
HVQCCN, LCC8,.12SQ,25
SOP, SOP8,.25
Pin Count
8
8, 8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
High Side Driver
YES
YES
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code
S-PQCC-N8
R-PDSO-G8
Length
3 mm
4.9 mm
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Peak Current Limit-Nom
4 A
4 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Equivalence Code
LCC8,.12SQ,25
SOP8,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.75 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
QUAD
DUAL
Turn-on Time
0.03 µs
0.03 µs
Width
3 mm
3.9 mm
Base Number Matches
1
2
Factory Lead Time
26 Weeks
JESD-609 Code
e3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Matte Tin (Sn) - annealed
Time@Peak Reflow Temperature-Max (s)
30
Compare ISL6208IR with alternatives
Compare ISL6208IBZ with alternatives