ISDMICROTAD-16ME
vs
I17210PY
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INFORMATION STORAGE DEVICES
WINBOND ELECTRONICS CORP
Part Package Code
TSOP
DIP
Package Description
,
DIP,
Pin Count
28
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Application
ANSWERING MACHINE
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDSO-G28
R-PDIP-T28
Number of Functions
1
1
Number of Terminals
28
28
Operating Temperature-Max
50 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
960 s
420 s
Supply Voltage-Max (Vsup)
3.15 V
5.5 V
Supply Voltage-Min (Vsup)
2.85 V
2.4 V
Surface Mount
YES
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
JESD-609 Code
e3
Length
36.83 mm
On Chip Memory Type
FLASH
Package Equivalence Code
DIP28,.6
Seated Height-Max
4.83 mm
Terminal Finish
MATTE TIN
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare ISDMICROTAD-16ME with alternatives
Compare I17210PY with alternatives