ISD4003-06MXD
vs
ISDMICROTAD-16ME
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
DIE
TSOP
Package Description
DIE,
8 X 13.40 MM, PLASTIC, TSOP1-28
Pin Count
19
28
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-XUUC-N19
R-PDSO-G28
Number of Functions
1
1
Number of Terminals
19
28
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
70 °C
50 °C
Operating Temperature-Min
-20 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
TSOP1
Package Equivalence Code
DIE OR CHIP
TSSOP28,.53,22
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
360 s
960 s
Supply Voltage-Max (Vsup)
3.3 V
3.15 V
Supply Voltage-Min (Vsup)
2.7 V
2.85 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Length
11.8 mm
Seated Height-Max
1.2 mm
Supply Current-Max
40 mA
Terminal Finish
TIN LEAD
Terminal Pitch
0.55 mm
Width
8 mm
Compare ISD4003-06MXD with alternatives
Compare ISDMICROTAD-16ME with alternatives