ISD33060E
vs
I17210PYI01
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
TSOP
DIP
Package Description
8 X 13.40 MM, PLASTIC, TSOP1-28
DIP,
Pin Count
28
28
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDSO-G28
R-PDIP-T28
JESD-609 Code
e0
e3
Length
11.8 mm
36.83 mm
Number of Functions
1
1
Number of Terminals
28
28
On Chip Memory Type
EEPROM
FLASH
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
DIP
Package Equivalence Code
TSSOP28,.53,22
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
62.3 s
420 s
Seated Height-Max
1.2 mm
4.83 mm
Supply Current-Max
40 mA
Supply Voltage-Max (Vsup)
3.3 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
2.4 V
Surface Mount
YES
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.55 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
8 mm
15.24 mm
Base Number Matches
2
1
Compare ISD33060E with alternatives
Compare I17210PYI01 with alternatives