I17210PYI01 vs ISD5008X feature comparison

I17210PYI01 Winbond Electronics Corp

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ISD5008X Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code DIP DIE
Package Description DIP, DIE,
Pin Count 28 25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-XUUC-N25
JESD-609 Code e3 e0
Length 36.83 mm
Number of Functions 1 1
Number of Terminals 28 25
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 50 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP28,.6 DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 420 s 480 s
Seated Height-Max 4.83 mm
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 2.4 V 2.7 V
Surface Mount NO YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 15.24 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Application CELLULAR PHONE; PORTABLE APPLIANCES

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