I17210PYI01
vs
ISD5008X
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
DIP
DIE
Package Description
DIP,
DIE,
Pin Count
28
25
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDIP-T28
R-XUUC-N25
JESD-609 Code
e3
e0
Length
36.83 mm
Number of Functions
1
1
Number of Terminals
28
25
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
85 °C
50 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIE
Package Equivalence Code
DIP28,.6
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
420 s
480 s
Seated Height-Max
4.83 mm
Supply Voltage-Max (Vsup)
5.5 V
3.3 V
Supply Voltage-Min (Vsup)
2.4 V
2.7 V
Surface Mount
NO
YES
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Width
15.24 mm
Base Number Matches
1
2
Pbfree Code
No
Rohs Code
No
Application
CELLULAR PHONE; PORTABLE APPLIANCES
Compare I17210PYI01 with alternatives
Compare ISD5008X with alternatives