IS61QDP2B21M36A-300B4I
vs
MCM69F817ZP6.5R
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA, BGA165,11X15,40
|
BGA,
|
| Pin Count |
165
|
119
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
0.45 ns
|
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
|
| Clock Frequency-Max (fCLK) |
300 MHz
|
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-PBGA-B165
|
|
| Length |
15 mm
|
|
| Memory Density |
37748736 bit
|
|
| Memory IC Type |
QDR SRAM
|
|
| Memory Width |
36
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
165
|
|
| Number of Words |
1048576 words
|
|
| Number of Words Code |
1000000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
1MX36
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Equivalence Code |
BGA165,11X15,40
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.4 mm
|
|
| Standby Current-Max |
0.28 A
|
|
| Standby Voltage-Min |
1.7 V
|
|
| Supply Current-Max |
1.1 mA
|
|
| Supply Voltage-Max (Vsup) |
1.89 V
|
|
| Supply Voltage-Min (Vsup) |
1.71 V
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
13 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare IS61QDP2B21M36A-300B4I with alternatives
Compare MCM69F817ZP6.5R with alternatives