MCM69F817ZP6.5R
vs
K7P163612M-HC48
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA, BGA119,7X17,50
Pin Count
119
119
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
2
1
Rohs Code
Access Time-Max
4.8 ns
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
Memory Density
18874368 bit
Memory IC Type
STANDARD SRAM
Memory Width
36
Number of Functions
1
Number of Terminals
119
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
512KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
2.55 mm
Standby Current-Max
0.15 A
Standby Voltage-Min
3.15 V
Supply Current-Max
0.5 mA
Supply Voltage-Max (Vsup)
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
14 mm
Compare MCM69F817ZP6.5R with alternatives
Compare K7P163612M-HC48 with alternatives