IS27C010-12WI vs HN27C101AP-12 feature comparison

IS27C010-12WI Integrated Silicon Solution Inc

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HN27C101AP-12 Hitachi Ltd

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC HITACHI LTD
Part Package Code DIP DIP
Package Description 0.600 INCH, PLASTIC, DIP-32 DIP, DIP32,.6
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 120 ns 120 ns
JESD-30 Code R-PDIP-T32 R-PDIP-T32
JESD-609 Code e0 e0
Length 41.91 mm 41.9 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 2
I/O Type COMMON
Package Equivalence Code DIP32,.6
Standby Current-Max 0.001 A
Supply Current-Max 0.05 mA

Compare IS27C010-12WI with alternatives

Compare HN27C101AP-12 with alternatives