Part Details for IS27C010-12WI by Integrated Silicon Solution Inc
Overview of IS27C010-12WI by Integrated Silicon Solution Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for IS27C010-12WI
IS27C010-12WI CAD Models
IS27C010-12WI Part Data Attributes:
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IS27C010-12WI
Integrated Silicon Solution Inc
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Datasheet
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IS27C010-12WI
Integrated Silicon Solution Inc
OTP ROM, 128KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Part Package Code | DIP | |
Package Description | 0.600 INCH, PLASTIC, DIP-32 | |
Pin Count | 32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 120 ns | |
JESD-30 Code | R-PDIP-T32 | |
JESD-609 Code | e0 | |
Length | 41.91 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.572 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for IS27C010-12WI
This table gives cross-reference parts and alternative options found for IS27C010-12WI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS27C010-12WI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27C010-120PC | OTP ROM, 128KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 | Spansion | IS27C010-12WI vs AM27C010-120PC |
HN27C101AP-12 | OTP ROM, 128KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Hitachi Ltd | IS27C010-12WI vs HN27C101AP-12 |
AT27LV010-12PC | OTP ROM, 128KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Atmel Corporation | IS27C010-12WI vs AT27LV010-12PC |
TC541000AP-12 | IC 128K X 8 OTPROM, 120 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM | Toshiba America Electronic Components | IS27C010-12WI vs TC541000AP-12 |
HN27C301AP-12 | 128KX8 OTPROM, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Renesas Electronics Corporation | IS27C010-12WI vs HN27C301AP-12 |
HN27C101AP-12 | 128KX8 OTPROM, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Renesas Electronics Corporation | IS27C010-12WI vs HN27C101AP-12 |
AT27LV010-12PI | OTP ROM, 128KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Atmel Corporation | IS27C010-12WI vs AT27LV010-12PI |