IP175DLFI
vs
KSZ8995M
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
| Ihs Manufacturer |
IC PLUS CORP
|
MICREL INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
| Length |
20 mm
|
20 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
128
|
128
|
| Number of Transceivers |
1
|
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Equivalence Code |
QFP128,.68X.91,20
|
QFP128,.67X.93,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Seated Height-Max |
3.42 mm
|
3.4 mm
|
| Supply Voltage-Nom |
1.9 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
SUPPORT CIRCUIT
|
LAN SWITCHING CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Package Description |
|
LEAD FREE, PLASTIC, QFP-128
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
0.25 mA
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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