IDT74LVCH32245ABF vs 74LVC32245AEC,557 feature comparison

IDT74LVCH32245ABF Renesas Electronics Corporation

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74LVC32245AEC,557 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Package Description LFBGA, BGA96,6X16,32 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT536-1, LFBGA-96
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DIRECTION CONTROL
Control Type COMMON CONTROL COMMON CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0
Length 13.5 mm 13.5 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 3 4
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 225
Prop. Delay@Nom-Sup 4 ns 4.5 ns
Propagation Delay (tpd) 4.7 ns 4.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 5.5 mm 5.5 mm
Base Number Matches 2 2
Part Package Code BGA
Pin Count 96
Manufacturer Package Code SOT536-1
Factory Lead Time 4 Weeks

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Compare 74LVC32245AEC,557 with alternatives