IDT74LVCH32245ABF
vs
74LVCH32245AEC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
PHILIPS SEMICONDUCTORS
Part Package Code
BGA
Package Description
LFBGA-96
FBGA, BGA96,6X16,32
Pin Count
96
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
1998-10-01
Additional Feature
WITH DIRECTION CONTROL
Control Type
COMMON CONTROL
COMMON CONTROL
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
LVC/LCX/Z
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
JESD-609 Code
e0
e0
Length
13.5 mm
Logic IC Type
BUS TRANSCEIVER
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
3
Number of Bits
8
8
Number of Functions
4
4
Number of Ports
2
Number of Terminals
96
96
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
FBGA
Package Equivalence Code
BGA96,6X16,32
BGA96,6X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
225
Prop. Delay@Nom-Sup
4 ns
4.5 ns
Propagation Delay (tpd)
4.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
5.5 mm
Base Number Matches
2
2
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