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74LVC32245AEC,557 vs 74LVCH32245AEC feature comparison

74LVC32245AEC,557 NXP Semiconductors

Buy Now Datasheet

74LVCH32245AEC Philips Semiconductors

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code BGA
Package Description 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT536-1, LFBGA-96 FBGA, BGA96,6X16,32
Pin Count 96
Manufacturer Package Code SOT536-1
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type COMMON CONTROL COMMON CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family LVC/LCX/Z
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 13.5 mm
Logic IC Type BUS TRANSCEIVER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 4
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA FBGA
Package Equivalence Code BGA96,6X16,32 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Prop. Delay@Nom-Sup 4.5 ns 4.5 ns
Propagation Delay (tpd) 4.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 5.5 mm
Base Number Matches 2 2
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn63Pb37)
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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