IDT74ALVCH16832PA vs 74ALVCH16832DGG,11 feature comparison

IDT74ALVCH16832PA Integrated Device Technology Inc

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74ALVCH16832DGG,11 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP64,.32,20 TSSOP,
Pin Count 64 64
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01
Family ALVC/VCX/A ALVC/VCX/A
JESD-30 Code R-PDSO-G64 R-PDSO-G64
JESD-609 Code e0 e4
Length 17 mm 17 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 7 1
Number of Functions 1 7
Number of Ports 2 2
Number of Terminals 64 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP64,.32,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 4.4 ns 4.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.3 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 6.1 mm 6.1 mm
Base Number Matches 1 1
Manufacturer Package Code SOT646-1

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Compare 74ALVCH16832DGG,11 with alternatives