IDT74ALVCH16832PA
vs
ALVCH16832DGG-T
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
TSSOP, TSSOP64,.32,20
|
TSSOP,
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ALVC/VCX/A
|
ALVC/VCX/A
|
| JESD-30 Code |
R-PDSO-G64
|
R-PDSO-G64
|
| JESD-609 Code |
e0
|
e4
|
| Length |
17 mm
|
17 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
7
|
1
|
| Number of Functions |
1
|
7
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP64,.32,20
|
TSSOP64,.32,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Propagation Delay (tpd) |
4.4 ns
|
4.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6.1 mm
|
6.1 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare IDT74ALVCH16832PA with alternatives
Compare ALVCH16832DGG-T with alternatives