IDT74ALVCH16244PF
vs
SN74ALVCH16244GRDR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
BGA
Package Description
TSSOP, TSSOP48,.25,16
TFBGA,
Pin Count
48
54
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
Family
ALVC/VCX/A
ALVC/VCX/A
JESD-30 Code
R-PDSO-G48
R-PBGA-B54
JESD-609 Code
e0
Length
9.7 mm
8 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Bits
4
4
Number of Functions
4
4
Number of Ports
2
2
Number of Terminals
48
54
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TFBGA
Package Equivalence Code
TSSOP48,.25,16
BGA54,6X9,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
3 ns
Propagation Delay (tpd)
3.6 ns
3.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
BALL
Terminal Pitch
0.4 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
5.5 mm
Base Number Matches
3
1
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