SN74ALVCH16244GRDR
vs
74ALVCH244DGVRE4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
SOIC
Package Description
TFBGA,
TSSOP, TSSOP20,.25,16
Pin Count
54
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ALVC/VCX/A
ALVC/VCX/A
JESD-30 Code
R-PBGA-B54
R-PDSO-G20
Length
8 mm
5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
4
4
Number of Functions
4
2
Number of Ports
2
2
Number of Terminals
54
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TSSOP
Package Equivalence Code
BGA54,6X9,32
TSSOP20,.25,16
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
3.7 ns
3.1 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.4 mm
Terminal Position
BOTTOM
DUAL
Width
5.5 mm
4.4 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Control Type
ENABLE LOW
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
2.8 ns
Terminal Finish
NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)
30
Compare SN74ALVCH16244GRDR with alternatives
Compare 74ALVCH244DGVRE4 with alternatives