IDT72V70200BC
vs
PEF24470
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INFINEON TECHNOLOGIES AG
Part Package Code
BGA
QFP
Package Description
11 X 11 MM, 1 MM PITCH, BGA-100
METRIC, PLASTIC, QFP-100
Pin Count
100
100
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B100
R-PQFP-G100
JESD-609 Code
e0
Length
11 mm
20 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
100
100
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
QFP
Package Equivalence Code
BGA100,10X10,40
QFP100,.7X.9
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
3.4 mm
Supply Current-Max
0.01 mA
0.2 mA
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
DIGITAL TIME SWITCH
DIGITAL TIME SWITCH
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
11 mm
14 mm
Base Number Matches
1
1
Technology
CMOS
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