IDT72V70200BC
vs
72V90823PFG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
TQFP
Package Description
11 X 11 MM, 1 MM PITCH, BGA-100
TQFP-100
Pin Count
100
100
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B100
S-PQFP-G100
JESD-609 Code
e0
e3
Length
11 mm
14 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
100
100
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LFQFP
Package Equivalence Code
BGA100,10X10,40
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.6 mm
Supply Current-Max
0.01 mA
0.045 mA
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
DIGITAL TIME SWITCH
DIGITAL TIME SWITCH
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
11 mm
14 mm
Base Number Matches
1
2
Pbfree Code
Manufacturer Package Code
PNG100
ECCN Code
EAR99
Compare IDT72V70200BC with alternatives
Compare 72V90823PFG with alternatives