IDT72V70200BC vs PEF20470 feature comparison

IDT72V70200BC Integrated Device Technology Inc

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PEF20470 Infineon Technologies AG

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INFINEON TECHNOLOGIES AG
Part Package Code BGA QFP
Package Description 11 X 11 MM, 1 MM PITCH, BGA-100 METRIC, PLASTIC, QFP-100
Pin Count 100 100
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B100 R-PQFP-G100
JESD-609 Code e0
Length 11 mm 20 mm
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 100
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA QFP
Package Equivalence Code BGA100,10X10,40 QFP100,.7X.9
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE FLATPACK
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 3.4 mm
Supply Current-Max 0.01 mA 0.2 mA
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 11 mm 14 mm
Base Number Matches 1 1
Technology CMOS

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