IDT72225L50J vs IDT72225L35FB feature comparison

IDT72225L50J Integrated Device Technology Inc

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IDT72225L35FB Integrated Device Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC QFP
Package Description PLASTIC, LCC-68 QFF,
Pin Count 68 68
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns
Clock Frequency-Max (fCLK) 20 MHz
Cycle Time 50 ns 35 ns
JESD-30 Code S-PQCC-J68 S-XQFP-F68
JESD-609 Code e0 e0
Memory Density 18432 bit 18432 bit
Memory IC Type OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1KX18 1KX18
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code QCCJ QFF
Package Equivalence Code LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.07 A
Supply Current-Max 0.25 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND FLAT
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Base Number Matches 1 1

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