IDT72225L35FB
vs
LH54V0235HU-25
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
SHARP CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
QFF,
|
0.950 INCH, PLASTIC, LCC-68
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Cycle Time |
35 ns
|
25 ns
|
| JESD-30 Code |
S-XQFP-F68
|
S-PQCC-J68
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
18432 bit
|
36864 bit
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Number of Words |
1024 words
|
2048 words
|
| Number of Words Code |
1000
|
2000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
1KX18
|
2KX18
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
QFF
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
FLAT
|
J BEND
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
17 ns
|
| Length |
|
24.1808 mm
|
| Memory IC Type |
|
OTHER FIFO
|
| Package Equivalence Code |
|
LDCC68,1.0SQ
|
| Seated Height-Max |
|
4.57 mm
|
| Supply Current-Max |
|
0.19 mA
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
24.1808 mm
|
|
|
|
Compare IDT72225L35FB with alternatives
Compare LH54V0235HU-25 with alternatives