IDT72225L35FB vs IDT72605L50J8 feature comparison

IDT72225L35FB Integrated Device Technology Inc

Buy Now Datasheet

IDT72605L50J8 Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP LCC
Package Description QFF, PLASTIC, LCC-68
Pin Count 68 68
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Cycle Time 35 ns 50 ns
JESD-30 Code S-XQFP-F68 S-PQCC-J68
JESD-609 Code e0 e0
Memory Density 18432 bit 4608 bit
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 1024 words 256 words
Number of Words Code 1000 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 1KX18 256X18
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code QFF QCCJ
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form FLAT J BEND
Terminal Position QUAD QUAD
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Access Time-Max 25 ns
Additional Feature BYPASS REGISTER
Clock Frequency-Max (fCLK) 20 MHz
Length 24.2062 mm
Memory IC Type BI-DIRECTIONAL FIFO
Moisture Sensitivity Level 1
Package Equivalence Code LDCC68,1.0SQ
Peak Reflow Temperature (Cel) 225
Seated Height-Max 4.572 mm
Standby Current-Max 0.23 A
Supply Current-Max 0.23 mA
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 24.2062 mm

Compare IDT72225L35FB with alternatives

Compare IDT72605L50J8 with alternatives