IDT7210L25PQF
vs
IDT7210L55CB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
DIP
Package Description
QFF,
TOP BRAZED, DIP-64
Pin Count
64
64
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Boundary Scan
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-F64
R-CDIP-T64
JESD-609 Code
e0
e0
Length
22.86 mm
81.407 mm
Low Power Mode
YES
YES
Number of Terminals
64
64
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Data Bus Width
35
19
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QFF
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.286 mm
4.572 mm
Supply Current-Max
270 mA
110 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
22.86 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches
1
1
Rohs Code
ECCN Code
3A001.A.2.C
Additional Feature
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 18.18MHZ
Clock Frequency-Max
18.18 MHz
Package Equivalence Code
DIP64,.9
Screening Level
38535Q/M;38534H;883B
Compare IDT7210L25PQF with alternatives
Compare IDT7210L55CB with alternatives