Findchips: Compare IDT7210L25PQF vs 5962-8873303YX

IDT7210L25PQF vs 5962-8873303YX feature comparison

Buy Now Datasheet

Buy Now

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	INTEGRATED DEVICE TECHNOLOGY INC	INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code	QFP	LCC
Package Description	QFF,	QCCN,
Pin Count	64	68
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Boundary Scan	NO	NO
External Data Bus Width	16	16
JESD-30 Code	S-PQFP-F64	S-XQCC-N68
JESD-609 Code	e0
Length	22.86 mm
Low Power Mode	YES	NO
Number of Terminals	64	68
Operating Temperature-Max	70 °C	125 °C
Operating Temperature-Min		-55 °C
Output Data Bus Width	35	35
Package Body Material	PLASTIC/EPOXY	UNSPECIFIED
Package Code	QFF	QCCN
Package Shape	SQUARE	SQUARE
Package Style	FLATPACK	CHIP CARRIER
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.286 mm
Supply Current-Max	270 mA
Supply Voltage-Max	5.5 V	5.5 V
Supply Voltage-Min	4.5 V	4.5 V
Supply Voltage-Nom	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	MILITARY
Terminal Finish	TIN LEAD
Terminal Form	FLAT	NO LEAD
Terminal Pitch	1.27 mm
Terminal Position	QUAD	QUAD
Width	22.86 mm
uPs/uCs/Peripheral ICs Type	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches	1	3
ECCN Code		3A001.A.2.C
Additional Feature		2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
Screening Level		MIL-STD-883
	Microcontrollers and Processors » DSP Peripherals	Microcontrollers and Processors » DSP Peripherals