IDT7203L50TDG vs IDT7203L50TP feature comparison

IDT7203L50TDG Integrated Device Technology Inc

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IDT7203L50TP Rochester Electronics LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Cycle Time 65 ns 65 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e3 e0
Length 37.1475 mm 34.671 mm
Memory Density 18432 bit 18432 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX9 2KX9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm 4.572 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Additional Feature RETRANSMIT
Memory IC Type OTHER FIFO
Supply Current-Max 0.12 mA

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