IDT7203L50TDG vs 7203S50TDB feature comparison

IDT7203L50TDG Integrated Device Technology Inc

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7203S50TDB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP
Package Description DIP, DIP, DIP28,.3
Pin Count 28
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Cycle Time 65 ns 65 ns
JESD-30 Code R-GDIP-T28 R-XDIP-T28
JESD-609 Code e3 e0
Length 37.1475 mm
Memory Density 18432 bit 18432 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2KX9 2KX9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 15 MHz
Memory IC Type OTHER FIFO
Package Equivalence Code DIP28,.3
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.012 A
Supply Current-Max 0.15 mA

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