IDT71V67813S183PF
vs
CXK77S36L80AGB-43A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
SONY CORP
Part Package Code
QFP
BGA
Package Description
LQFP,
BGA, BGA119,7X17,50
Pin Count
100
119
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.3 ns
4.4 ns
JESD-30 Code
R-PQFP-G100
R-PBGA-B119
JESD-609 Code
e0
e0
Length
20 mm
22 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
CACHE SRAM
LATE-WRITE SRAM
Memory Width
18
36
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
100
119
Number of Words
524288 words
262144 words
Number of Words Code
512000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
Organization
512KX18
256KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
2.5 mm
Supply Voltage-Max (Vsup)
3.465 V
3.47 V
Supply Voltage-Min (Vsup)
3.135 V
3.13 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
1
1
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Standby Current-Max
0.1 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.74 mA
Compare IDT71V67813S183PF with alternatives
Compare CXK77S36L80AGB-43A with alternatives