CXK77S36L80AGB-43A
vs
UPD4382321GF-A90
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SONY CORP
RENESAS ELECTRONICS CORP
Part Package Code
BGA
Package Description
BGA, BGA119,7X17,50
Pin Count
119
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.4 ns
9 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B119
R-PQFP-G100
JESD-609 Code
e0
e0
Length
22 mm
Memory Density
9437184 bit
8388608 bit
Memory IC Type
LATE-WRITE SRAM
STANDARD SRAM
Memory Width
36
32
Number of Functions
1
Number of Terminals
119
100
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
Organization
256KX36
256KX32
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
QFP
Package Equivalence Code
BGA119,7X17,50
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.5 mm
Standby Current-Max
0.1 A
0.01 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.74 mA
0.33 mA
Supply Voltage-Max (Vsup)
3.47 V
Supply Voltage-Min (Vsup)
3.13 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.635 mm
Terminal Position
BOTTOM
QUAD
Width
14 mm
Base Number Matches
1
2
Clock Frequency-Max (fCLK)
90 MHz
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