71V35761S200BGGI8 vs 71V35761YS200BG feature comparison

71V35761S200BGGI8 Integrated Device Technology Inc

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71V35761YS200BG Integrated Device Technology Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PBGA BGA
Pin Count 119 119
Manufacturer Package Code BGG119
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
JESD-609 Code e1 e0
Memory IC Type CACHE SRAM CACHE SRAM
Moisture Sensitivity Level 3 3
Peak Reflow Temperature (Cel) 260 225
Terminal Finish TIN SILVER COPPER TIN LEAD
Base Number Matches 1 1
Package Description BGA-119
Access Time-Max 3.1 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119
Length 22 mm
Memory Density 4718592 bit
Memory Width 36
Number of Functions 1
Number of Terminals 119
Number of Words 131072 words
Number of Words Code 128000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.36 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.36 mA
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm

Compare 71V35761S200BGGI8 with alternatives

Compare 71V35761YS200BG with alternatives