IDT71V2578SA150BQI
vs
MT58L256V18F1F-8.5
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
FBGA-165
|
TBGA,
|
Pin Count |
165
|
165
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
3.8 ns
|
8.5 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
FLOW-THROUGH ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
150 MHz
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
JESD-609 Code |
e0
|
e0
|
Length |
15 mm
|
15 mm
|
Memory Density |
4718592 bit
|
4718592 bit
|
Memory IC Type |
STANDARD SRAM
|
CACHE SRAM
|
Memory Width |
18
|
18
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
165
|
165
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
256KX18
|
256KX18
|
Output Characteristics |
3-STATE
|
|
Output Enable |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
TBGA
|
Package Equivalence Code |
BGA165,11X15,40
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
225
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Standby Current-Max |
0.035 A
|
|
Standby Voltage-Min |
3.13 V
|
|
Supply Current-Max |
0.305 mA
|
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
13 mm
|
13 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare IDT71V2578SA150BQI with alternatives
Compare MT58L256V18F1F-8.5 with alternatives