MT58L256V18F1F-8.5
vs
IDT71V35781YS183BQ
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
FBGA-165
|
FBGA-165
|
| Pin Count |
165
|
165
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
8.5 ns
|
3.3 ns
|
| Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
100 MHz
|
183 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
| JESD-609 Code |
e0
|
e0
|
| Length |
15 mm
|
15 mm
|
| Memory Density |
4718592 bit
|
4718592 bit
|
| Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
165
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX18
|
256KX18
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
TBGA
|
| Package Equivalence Code |
BGA165,11X15,40
|
BGA165,11X15,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Standby Current-Max |
0.01 A
|
0.03 A
|
| Standby Voltage-Min |
3.14 V
|
3.14 V
|
| Supply Current-Max |
0.325 mA
|
0.34 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
13 mm
|
13 mm
|
| Base Number Matches |
2
|
1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MT58L256V18F1F-8.5 with alternatives
Compare IDT71V35781YS183BQ with alternatives