IDT70914S15PF9
vs
70914S15JG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
LCC
Package Description
TQFP-80
QCCJ, LDCC68,1.0SQ
Pin Count
80
68
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
Additional Feature
AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; SELF TIMED WRITE
JESD-30 Code
S-PQFP-G80
S-PQCC-J68
JESD-609 Code
e0
e3
Length
14 mm
24.13 mm
Memory Density
36864 bit
36864 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
9
9
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
80
68
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4KX9
4KX9
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
4.572 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
14 mm
24.13 mm
Base Number Matches
1
1
I/O Type
COMMON
Package Equivalence Code
LDCC68,1.0SQ
Standby Current-Max
0.015 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.3 mA
Compare IDT70914S15PF9 with alternatives
Compare 70914S15JG with alternatives