70914S15JG
vs
IDT70914S15PF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
QFP
Package Description
QCCJ, LDCC68,1.0SQ
TQFP-80
Pin Count
68
80
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQCC-J68
S-PQFP-G80
JESD-609 Code
e3
e0
Length
24.13 mm
14 mm
Memory Density
36864 bit
36864 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
9
9
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
68
80
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4KX9
4KX9
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
LQFP
Package Equivalence Code
LDCC68,1.0SQ
QFP80,.64SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
1.6 mm
Standby Current-Max
0.015 A
0.015 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.3 mA
0.3 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
20
Width
24.13 mm
14 mm
Base Number Matches
1
1
Additional Feature
AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; SELF TIMED WRITE
Output Enable
YES
Compare 70914S15JG with alternatives
Compare IDT70914S15PF with alternatives