70914S15JG
vs
70V914S15PF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
TQFP
Package Description
QCCJ, LDCC68,1.0SQ
,
Pin Count
68
80
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
I/O Type
COMMON
JESD-30 Code
S-PQCC-J68
JESD-609 Code
e3
e0
Length
24.13 mm
Memory Density
36864 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
9
Moisture Sensitivity Level
1
3
Number of Functions
1
Number of Ports
2
Number of Terminals
68
Number of Words
4096 words
Number of Words Code
4000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
4KX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
QCCJ
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
Package Style
CHIP CARRIER
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
240
Qualification Status
Not Qualified
Seated Height-Max
4.572 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.3 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
J BEND
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
24.13 mm
Base Number Matches
1
1
Manufacturer Package Code
PN80
Compare 70914S15JG with alternatives
Compare 70V914S15PF with alternatives