ICY7C1373C-100BGI
vs
HM6AQB18202BP40
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
RENESAS ELECTRONICS CORP
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165
Pin Count
119
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
8.5 ns
0.45 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
JESD-30 Code
R-PBGA-B119
R-PBGA-B165
JESD-609 Code
e0
e1
Length
22 mm
17 mm
Memory Density
18874368 bit
37748736 bit
Memory IC Type
ZBT SRAM
QDR SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
119
165
Number of Words
1048576 words
2097152 words
Number of Words Code
1000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX18
2MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
1.46 mm
Supply Voltage-Max (Vsup)
3.63 V
1.9 V
Supply Voltage-Min (Vsup)
3.135 V
1.7 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
15 mm
Base Number Matches
1
1
Pbfree Code
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
20
Compare ICY7C1373C-100BGI with alternatives
Compare HM6AQB18202BP40 with alternatives