ICS93V857YK-130T
vs
MC100EP220TB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MOTOROLA INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN,
|
HLQFP,
|
| Pin Count |
40
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
93V
|
100E
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
S-PQCC-N40
|
S-PQFP-G52
|
| JESD-609 Code |
e0
|
e0
|
| Length |
6 mm
|
10 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
1
|
2
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
40
|
52
|
| Number of True Outputs |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HLQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.06 ns
|
0.06 ns
|
| Seated Height-Max |
1 mm
|
1.7 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
3.8 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
6 mm
|
10 mm
|
| fmax-Min |
170 MHz
|
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
ECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V
|
| Package Equivalence Code |
|
QFP52,.47SQ
|
| Propagation Delay (tpd) |
|
0.55 ns
|
| Technology |
|
ECL
|
|
|
|
Compare ICS93V857YK-130T with alternatives
Compare MC100EP220TB with alternatives