ICS853P022AGLF
vs
ICS853P022AGT
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
TSSOP
|
TSSOP
|
Package Description |
3 X 3 MM, 0.95 MM HEIGHT, LEAD FREE, MO-187, TSSOP-8
|
TSSOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V
|
ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V
|
Delay-Max |
|
0.6 ns
|
Interface IC Type |
TTL/CMOS TO PECL TRANSLATOR
|
TTL/CMOS TO PECL TRANSLATOR
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e3
|
e0
|
Length |
3 mm
|
3 mm
|
Number of Bits |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Latch or Register |
NONE
|
NONE
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
1
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare ICS853P022AGLF with alternatives
Compare ICS853P022AGT with alternatives