ICS1893BFLF
vs
ICS1893BKI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
SSOP
DFN
Package Description
0.300 INCH, LEAD FREE, SSOP-48
8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56
Pin Count
48
56
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
kg CO2e/kg
12.04
Average Weight (mg)
860.05
CO2e (mg)
10355.002
Total Weight
625.1
Category CO2 Kg
12.04
CO2
7526.204
Compliance Temperature Grade
Commercial: +0C to +70C
EU RoHS Version
RoHS 2 (2015/863/EU)
Candidate List Date
2020-01-16
CAS Accounted for Wt
91
CA Prop 65 Presence
YES
CA Prop 65 CAS Numbers
7439-92-1, 1333-86-4
EFUP
e
Conflict Mineral Status
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
FMD
Data Rate
100000 Mbps
JESD-30 Code
R-PDSO-G48
S-PQCC-N56
JESD-609 Code
e3
e0
Length
15.875 mm
8 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
48
56
Number of Transceivers
1
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
HVQCCN
Package Equivalence Code
SSOP48,.4
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.8 mm
1 mm
Supply Current-Max
0.16 mA
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.635 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
8 mm
Base Number Matches
2
4
Manufacturer Package Code
MLF
Compare ICS1893BFLF with alternatives
Compare ICS1893BKI with alternatives