ICS1893BKI vs ICS1893BFIT feature comparison

ICS1893BKI Integrated Device Technology Inc

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ICS1893BFIT Integrated Circuit Systems Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED CIRCUIT SYSTEMS INC
Part Package Code DFN
Package Description 8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56 0.300 INCH, SSOP-48
Pin Count 56
Manufacturer Package Code MLF
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
JESD-30 Code S-PQCC-N56 R-PDSO-G48
JESD-609 Code e0
Length 8 mm 15.875 mm
Number of Functions 1 1
Number of Terminals 56 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SSOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 2.8 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.635 mm
Terminal Position QUAD DUAL
Width 8 mm 7.5 mm
Base Number Matches 1 2

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