ICM7555ID/T3
vs
NE555D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
SOIC
SOIC
Package Description
LSOP,
SOP-8
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Analog IC - Other Type
PULSE
PULSE; RECTANGULAR
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
e3
Length
4.9 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Frequency-Max
0.5 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSOP
SOP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE
SMALL OUTLINE
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.68 mm
1.8 mm
Supply Voltage-Max (Vsup)
16 V
16 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
1
6
Pbfree Code
Additional Feature
IT CAN ALSO OPERATE AT 15V NOMINAL SUPPLY
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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