Findchips: Compare IBM25PPC750L-GB500C2T vs TSPC750AMGSB/Q12LE

IBM25PPC750L-GB500C2T vs TSPC750AMGSB/Q12LE feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	IBM MICROELECTRONICS	ATMEL CORP
Part Package Code	BGA	CGA
Package Description	25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360	CGA,
Pin Count	360	360
Reach Compliance Code	unknown	compliant
Address Bus Width	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	100 MHz	83.3 MHz
External Data Bus Width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-CBGA-B360	S-CBGA-C360
Length	25 mm	25 mm
Low Power Mode	YES	YES
Number of Terminals	360	360
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA	CGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.2 mm	4.2 mm
Speed	500 MHz	266 MHz
Supply Voltage-Nom	2 V	2.6 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	BALL	C BEND
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1
Rohs Code		No
ECCN Code		3A991.A.2
HTS Code		8542.31.00.01
Bit Size		32
Moisture Sensitivity Level		1
Operating Temperature-Max		125 °C
Operating Temperature-Min		-55 °C
Screening Level		MIL-STD-883 Class B
Supply Voltage-Max		2.7 V
Supply Voltage-Min		2.5 V
Temperature Grade		MILITARY
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors