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Overview of IBM25PPC750L-GB500C2T by IBM
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for IBM25PPC750L-GB500C2T by IBM
Part Data Attributes for IBM25PPC750L-GB500C2T by IBM
|
|
---|---|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
IBM MICROELECTRONICS
|
Part Package Code
|
BGA
|
Package Description
|
25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
|
Pin Count
|
360
|
Reach Compliance Code
|
unknown
|
Address Bus Width
|
32
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
100 MHz
|
External Data Bus Width
|
64
|
Format
|
FLOATING POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-CBGA-B360
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Length
|
25 mm
|
Low Power Mode
|
YES
|
Number of Terminals
|
360
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
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Qualification Status
|
Not Qualified
|
Seated Height-Max
|
3.2 mm
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Speed
|
500 MHz
|
Supply Voltage-Nom
|
2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
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Width
|
25 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
Alternate Parts for IBM25PPC750L-GB500C2T
This table gives cross-reference parts and alternative options found for IBM25PPC750L-GB500C2T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IBM25PPC750L-GB500C2T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
PPC7448HX1250NC | 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | IBM25PPC750L-GB500C2T vs PPC7448HX1250NC |
TSPC750AVGB/Q12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | IBM25PPC750L-GB500C2T vs TSPC750AVGB/Q12LE |
PPC7448HX800NC | 32-BIT, 800MHz, RISC PROCESSOR, CBGA360 | NXP Semiconductors | IBM25PPC750L-GB500C2T vs PPC7448HX800NC |
TSXPC750AMGSU8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | IBM25PPC750L-GB500C2T vs TSXPC750AMGSU8LE |
IBM25PPC740-DB0M2000 | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | IBM25PPC750L-GB500C2T vs IBM25PPC740-DB0M2000 |
IBM25PPC750L-GB433A2T | RISC Microprocessor, 32-Bit, 433MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | IBM25PPC750L-GB500C2T vs IBM25PPC750L-GB433A2T |
TSPC750AMGSB/Q12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | IBM25PPC750L-GB500C2T vs TSPC750AMGSB/Q12LE |
PPC7448VU1000LD | 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 | Freescale Semiconductor | IBM25PPC750L-GB500C2T vs PPC7448VU1000LD |
PC7410VG450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | IBM25PPC750L-GB500C2T vs PC7410VG450LE |
PPC7448HX1000LC | 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360 | Freescale Semiconductor | IBM25PPC750L-GB500C2T vs PPC7448HX1000LC |