MPC850ZT33
vs
XPC850DEVR50BU
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256
Pin Count
256
256
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
SUPPORTS MULTIPLE PROTOCOLS
JESD-30 Code
R-PBGA-B256
S-PBGA-B256
Number of Terminals
256
256
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
Rohs Code
ECCN Code
5A991
Address Bus Width
26
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-609 Code
e1
Length
23 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Seated Height-Max
2.35 mm
Speed
50 MHz
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
23 mm
Compare MPC850ZT33 with alternatives
Compare XPC850DEVR50BU with alternatives