IBM25PPC405GPR-3DB266CZ
vs
PPC405GPR3DB266
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
IBM MICROELECTRONICS
APPLIED MICRO CIRCUITS CORP
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
456
456
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
66.66 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
Length
27 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
456
456
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.21 mm
2.65 mm
Speed
266 MHz
266.66 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Rohs Code
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code
e0
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
Compare IBM25PPC405GPR-3DB266CZ with alternatives
Compare PPC405GPR3DB266 with alternatives