IBM21S850
vs
TLE6250GV33
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
End Of Life
Ihs Manufacturer
IBM MICROELECTRONICS
INFINEON TECHNOLOGIES AG
Part Package Code
QFP
SOIC
Package Description
LFQFP,
Pin Count
80
8
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G80
R-PDSO-G8
JESD-609 Code
e0
e3
Length
12 mm
5 mm
Number of Functions
1
1
Number of Terminals
80
8
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
SOP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.75 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
ETHERNET TRANSCEIVER
CAN TRANSCEIVER
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Width
12 mm
4 mm
Base Number Matches
1
1
Samacsys Manufacturer
Infineon
Data Rate
1000 Mbps
Moisture Sensitivity Level
3
Number of Transceivers
1
Package Equivalence Code
SOP8,.25
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Supply Current-Max
0.07 mA
Technology
BICMOS
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare IBM21S850 with alternatives
Compare TLE6250GV33 with alternatives